25Q64FWFIG datasheet, memory equivalent, Winbond

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.... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS .... 6 3.1 Pin Configuration SOIC / VSOP 208-mil ........ 6 3.2 Pad Configuration WSON 6x5-mm / 8x6-mm 6 3.3 Pin Descripti.

Description

......... 5 2. FEATURES..... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS .... 6 3.1 Pin Configuration SOIC / VSOP 208-mil ........ 6 3.2 Pad Configuration WSON 6x5-mm / 8x6-mm 6 3.3 Pin Description SOIC/VSOP 208-mil, WSON 6x5-mm / 8x6-mm 6 3.4 Pin Co.

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