25Q32BVIP datasheet, memory equivalent, Winbond

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Features and benefits

.... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS .... 6 3.1 Pin Configuration SOIC / VSOP 208-mil ........ 6 3.2 Pad Configuration WSON 6x5-mm / 8X6-mm 6 3.3 Pin Configurat.

Description

. 5 2. FEATURES..... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS .... 6 3.1 Pin Configuration SOIC / VSOP 208-mil ........ 6 3.2 Pad Configuration WSON 6x5-mm / 8X6-mm 6 3.3 Pin Configuration PDIP 300-mil.. 7 3.4 Pin Description SOIC/VSOP 208-mil, WSON.

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