25Q16CVVIG datasheet, memory equivalent, Winbond

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Features and benefits

.... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS .... 6 3.1 Pin Configuration SOIC / VSOP 150 / 208-mil ......... 6 3.2 Pad Configuration WSON 6x5-mm ...... 6 3.3 Pin Confi.

Description

. 5 2. FEATURES..... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS .... 6 3.1 Pin Configuration SOIC / VSOP 150 / 208-mil ......... 6 3.2 Pad Configuration WSON 6x5-mm ...... 6 3.3 Pin Configuration PDIP 300-mil.. 7 3.4 Pin Description SOIC / VSOP 150/20.

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