25Q16CLNIG datasheet, memory equivalent, Winbond

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.... 5 3. PACKAGE TYPES.... 6 3.1 Pin Configuration SOIC 150 / 208-mil, VSOP 150-MIL...... 6 3.2 PAD Configuration WSON 6x5-mm ..... 6 3.3 Pin Descriptions...... 7 3.3.1 .

Description

. 5 2. FEATURES..... 5 3. PACKAGE TYPES.... 6 3.1 Pin Configuration SOIC 150 / 208-mil, VSOP 150-MIL...... 6 3.2 PAD Configuration WSON 6x5-mm ..... 6 3.3 Pin Descriptions...... 7 3.3.1 Chip Select (/CS)......7 3.3.2 Serial Data Input, Output and IOs.

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