25Q01JVBIM datasheet, memory equivalent, Winbond

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......... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS 6 3.1 Pad Configuration WSON 8x6-mm .. 6 3.2 Pad Description WSON 8x6-mm ..... 6 3.3 Pin Configuration SOIC 300-m.

Description

.... 5 2. FEATURES ......... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS 6 3.1 Pad Configuration WSON 8x6-mm .. 6 3.2 Pad Description WSON 8x6-mm ..... 6 3.3 Pin Configuration SOIC 300-mil ....... 7 3.4 Pin Description SOIC 300-mil 7 3.5 Ball .

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