25N01GVTBIG datasheet, memory equivalent, Winbond

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.... 6 3. PACKAGE TYPES AND PIN CONFIGURATIONS .... 7 3.1 Pad Configuration WSON 8x6-mm ...... 7 3.2 Pad Description WSON 8x6-mm 7 3.3 Pin Configuration SOIC 300-.

Description

......... 6 2. FEATURES..... 6 3. PACKAGE TYPES AND PIN CONFIGURATIONS .... 7 3.1 Pad Configuration WSON 8x6-mm ...... 7 3.2 Pad Description WSON 8x6-mm 7 3.3 Pin Configuration SOIC 300-mil . 8 3.4 Pi.

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