W3H32M72E-XSBX datasheet, package equivalent, White Electronic Designs

W3H32M72E-XSBX package equivalent, 32m x 72 ddr2 sdram 208 pbga multi-chip package.

Features and benefits

Data rate = 667*, 533, 400 Package:
* 208 Plastic Ball Grid Array (PBGA), 18 x 20mm
* 1.0mm pitch Differential data strobe (DQS, DQS#) per byte www.DataSheet4U.co.

Application

Upgradable to 64M x 72 density (contact factory for information) * This product is under development, is not qualiﬁed or.

Description

Symbol ODT Type Input Description W3H32M72E-XSBX PRELIMINARY* On-Die termination: ODT (registered HIGH) enables termination resistance internal to the DDR2 SDRAM. When enabled, ODT is only applied to each of the following balls: DQ0
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