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WSF2816-39XX - 128K x 16 SRAM / 512K x 16 FLASH MODULE

Description

FD0-15 SD0-15 A0-18 SWE1-2# SCS1-2# OE# VCC GND NC FWE1-2# FCS1-2# Flash Data Inputs/Outputs SRAM Data Inputs/Outputs Address Inputs SRAM Write Enable SRAM Chip Selects Output Enable Power Supply Ground Not Connected Flash Write Enable Flash Chip Select 56 Block Diagram S W E 1 # S CS 1 # S W E 2

Features

  • Access Times of 35ns (SRAM) and 90ns (FLASH) Packaging.
  • 66 pin, PGA Type, 1.075" square HIP, Hermetic Ceramic HIP (Package 400).
  • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880") square (Package 510) 3.56mm (0.140") height. Designed to fit JEDEC 68 lead 0.990” CQFJ footprint (FIGURE 2) 128Kx16 SRAM 512Kx16 5V FLASH Organized as 128Kx16 of SRAM and 512Kx16 of Flash Memory with separate Data Buses Both blocks of memory are User Configurable as 256Kx8 Low Power CMOS Commercial, Industri.

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Datasheet Details

Part number WSF2816-39XX
Manufacturer White Electronic
File Size 633.38 KB
Description 128K x 16 SRAM / 512K x 16 FLASH MODULE
Datasheet download datasheet WSF2816-39XX Datasheet

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Other Datasheets by White Electronic

Part Number Description
WSF256K8-xCx 256Kx8 SRAM/ FLASH MODULE
WSF128K16-xxx 128K X 16 SRAM /FLASH MODULE
WSF128K32-xH2x 128K x 32 SRAM/FLASH MODULE
WSF41632-22XX 128K x 32 SRAM & 512K x 32 FLASH MIXED MODULE
WSF512K16-XXX 512K x 16 SRAM/FLASH MODULE

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www.DataSheet4U.com White Electronic Designs 128KX16 SRAM/512KX16 FLASH MODULE FEATURES Access Times of 35ns (SRAM) and 90ns (FLASH) Packaging • 66 pin, PGA Type, 1.075" square HIP, Hermetic Ceramic HIP (Package 400) • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880") square (Package 510) 3.56mm (0.140") height. Designed to fit JEDEC 68 lead 0.
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