W7MG21M32SVx-BN Datasheet | White Electronic

DESCRIPTION The W7MG1M32SVx-BN and W7MG21M32SVx-BN are organized as one and two banks of 1Mx32 respectively. The modules are based on AMDs Mirror Bit™ AM29LV160M - 1Mx16 or S29AL016M (optional) Flash device in TSOP packages which are mounted on an FR4 substrate. Both modules offer access times between 70 and 120ns allowing for operation of high-speed microprocessors without wait states. Top boot block configurations - Bottom boot block optional. Contact WEDC. Embedded Erase Algorithms - Automatically preprograms and erases the chip or any bination of sectors Embedded Program Algorithms - Automatically programs and verifies data at specified address Data Polling and Toggle Bit feature for detection of program or erase cycle pletion Low Power Dissipation - 30m A per Device Active Current - 10µA per Device CMOS Standby Current Single 3.3V ±10% Supply CMOS and TTL patible Inputs and Outputs mercial and industrial operating temperature range - BNC = 0°C to 70°C mercial - BNI = -40°C to 85°C Industrial Package - 80 Pin SIMM (JEDEC) Standard - This product is under development, is not qualified or characterized and is subject to change without notice. FEATURES 1Mx32 and 2x1Mx32 Densities Based on AMD - AM29LV160M Flash Device Spansion™ - S29AL016M (optional) High Performance - Access time as fast as 70ns - 0.7s typical sector erase time 3V for read, erase, and program operations Flexible, Sector Architecture - One 16Kbyte, two 8Kbyte, one 32Kbyte and thirty-one 64Kbyte sectors. - Any bination of sectors can be erased - Also supports full chip erase .. FIG. 1 - BLOCK DIAGRAMS W7MG1M32SVx-BN: 1Mx32 80 PIN SIMM WE2# 1Mx16 WE# DQ0-15 CE# CE# Addr 0-19 W7MG21M32SVx-BN: 2x1Mx32 80 PIN SIMM WE2# 1Mx16 WE# DQ0-15 CE# CE# Addr 0-19 1Mx16 WE# DQ0-15 1Mx16 WE# CE# CE# Addr 0-19 DQ16-31 DQ16-31 WE0# 1Mx16 WE# DQ0-15 CE# CE# WE0# DQ0-15 CE# CE# DQ0-15 Addr 0-19 1Mx16 WE# DQ0-15 CE#...