WIMN10 array equivalent, surface mount switching multi-chip diode array.
* Ultra High Speed Switching * Ultra-Small Surface Mount Package * For General Purpose Switching Applications * High Conductance Power Dissipation
6 1
TSOP-6
Mechanica.
* High Conductance Power Dissipation
6 1
TSOP-6
Mechanical Data: * Case : TSOP-6 * Case Material : Molded Plastic. UL .
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