* High thermal cycling performance
* Soft recovery characteristic
* Low on-state losses
* Surface-mountable package
* Low thermal resistance
* Enh.

*
* Dual Mode (DCM and CCM) PFC Power Factor Correction (PFC) for Interleaved Topology 4. Quick reference data.

Enhanced ultrafast power diode in a TO252 (DPAK) plastic package. 2. Features and benefits
* High thermal cycling performance
* Soft recovery characteristic
* Low on-state losses
* Surface-mountable package
* Low thermal resistan.

BYV52

BYV52-200

BYV52HR

BYV52PI

BYV52PI-200

BYV541V

BYV541V-200

BYV54HR

BYV54V

BYV54V-200

BYV56

BYV56A

BYV56B

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