* Schottky Barrier Chip
* Guard Ring Die Construction for Transient Protection
* High Surge Current Capability
* Low Power Loss, High Efficiency
* Ide.

Mechanical Data
* Case: DPAK/TO-252, Molded Plastic
* Terminals: Plated Leads Solderable per MIL-STD-202, Method.

MBRD1040

MBRD1040CT

MBRD1045

MBRD1045CT

MBRD1045G

MBRD1045S

MBRD10100

MBRD10100CT

MBRD10100S

MBRD1010CT

MBRD10150

MBRD10150CT

MBRD10150S

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