* Silicon Epitaxial Planar Die Construction
* Glass Package Version for High Reliability
* Fast Switching Speed
* High Conductance
* For General Purpo.

Mechanical Data
* Case: MiniMELF, Molded Glass
* Terminals: Plated Leads Solderable per MIL-STD-202, Method 208 .

Since 2006. D4U Semicon.   |   Contact Us   |   Privacy Policy   |   Purchase of parts