SMBF15J10CA Datasheet

Features and Benefits

 Low profile package
 Low inductance
 Excellent clamping capability
 1500W peak pulse power capability at 10/1000μs waveform.
 Typical IR less than 1μA above 14V
 High temperature to reflow soldering: 260℃/40s at terminals
 Very fast response time
 Moisture Sensitivity Level 1 MECHANICAL DA.