GDZJ4.3B-N
Key Features
- Planar Die construction
- 500mW Power Dissipation
- Ideally Suited for Automated Assembly Processes
- Case: Molded Glass DO-34
- Terminals: Solderable per MIL-STD-202, Method 208
- Polarity: See Diagram Below
- Approx. Weight:0.09 grams
- Mounting Position: Any
- Packing information
