* Batch process design, excellent power dissipation offers Package outline better reverse leakage current and thermal resistance.
* Low profile surface mounted .

z Hig
*hHCigohncduurrcetnat ncacpeability, low forward voltage drop. z Pb-
*
*FGHrieugaehrdspruairncggekfaocar.

BAS16

BAS16-02L

BAS16-02V

BAS16-02W

BAS16-03W

BAS16-07L4

BAS16-AU

BAS16-G

BAS16D

BAS16D-G

BAS16DXV6

BAS16DXV6T1

BAS16DXV6T1G

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