SMP26 Key Features
- Very low profile
- typical height of 1.0 mm
- Ideal for automated placement
- Available in uni-directional
- 400 W peak pulse power capability with a 10/1000 µs waveform
- Excellent clamping capability
- Very fast response time
- Low incremental surge resistance
- Meets MSL level 1, per J-STD-020
- Solder dip 260 °C, 40 s