Nickel barrier plating virtually eliminates silver migration. Solderability: 90% coverage after 5 second dip in 235°C solder following 60 second preheat at 120°C to 150°C and type R flux dip. Resistance To Solder Heat: 10 seconds in 260°C solder after preheat and flux per above. Terminal Strength: (1210) 1.0kg, (1806) 1.0kg, (1812) 1.5kg for 30 seconds. Beam Strength: (1210) 2.5kg, (1806) 2.
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