Datasheet Details
| Part number | FCSP2H40LTR |
|---|---|
| Manufacturer | Vishay |
| File Size | 159.65 KB |
| Description | Chip Scale Package Schottky Barrier Rectifier |
| Download | FCSP2H40LTR Download (PDF) |
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| Part number | FCSP2H40LTR |
|---|---|
| Manufacturer | Vishay |
| File Size | 159.65 KB |
| Description | Chip Scale Package Schottky Barrier Rectifier |
| Download | FCSP2H40LTR Download (PDF) |
|
|
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Vishay's FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry.
The four bump 1.5 x 1.5 mm devices can deliver up to 1.5 A and occupy only 2.3 mm2 of board space.
The anode and cathode connections are made through solder bump pads on one side of the silicon enabling designers to strategically place the diodes on the PCB.
FCSP2H40LTR Vishay High Power Products FlipKY®, 1.5 A Chip Scale Package Schottky Barrier.
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