WSLP0805R0100FEA18
Key Features
- Very high power to foot print size ratio (1 W in 0805 package)
- Proprietary processing technique produces extremely low resistance values (down to 0.005 )
- All welded construction
- Solid metal nickel-chrome or manganese- copper alloy resistive element with low TCR (< 20 ppm/°C)
- Very low inductance 0.5 nH to 5 nH
- Excellent frequency response to 50 MHz
- Low thermal EMF (< 3 μV/°C)