TMBS®
* Low profile package
* Ideal for automated placement
* Trench MOS Schottky technology
* Low power losses, high efficiency
* Low forward voltage.

PRIMARY CHARACTERISTICS IF(AV) VRRM IFSM VF at IF = 2.0 A TJ max. 2.0 A 100 V 60 A 0.56 V 150 °C For use in low voltage.

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