VS-ETF075Y60U power-module equivalent, emipak-2b pressfit power-module.
* Trench IGBT technology
* FRED Pt® clamping diodes
* PressFit pins technology
* Exposed Al2O3 substrate with low thermal
resistance
* Short circuit r.
VS-ETF075Y60U is an integrated solution for a multi level inverter stage in a single package. The EMIPAK-2B package is easy to use thanks to the PressFit pins and the exposed substrate provides improved thermal performance. The optimized layout also .
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