VS-ENQ030L120S power-module equivalent, emipak-1b pressfit power-module.
* Ultrafast Trench IGBT technology
* HEXFRED® and silicon carbide diode technology
* PressFit pins technology
* Exposed Al2O3 substrate with low thermal r.
VS-ENQ030L120S is an integrated solution for a neutral point clamp topology in a single package. The EMIPAK-1B package is easy to use thanks to the PressFit pins and the exposed substrate provides improved thermal performance. The optimized layout al.
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