Download the UGB8DT datasheet PDF.
This datasheet also covers the UGB8AT variant, as both devices belong to the same ultrafast rectifier family and are provided as variant models within a single manufacturer datasheet.
Key Features
Glass passivated chip junction.
Ultrafast recovery time.
Low switching losses, high efficiency.
High forward surge capability.
Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package).
Solder dip 260 °C, 40 s (for TO-220AC and ITO-220AC package).
Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC.
Full PDF Text Transcription for UGB8DT (Reference)
Note: Below is a high-fidelity text extraction (approx. 800 characters) for
UGB8DT. For precise diagrams, and layout, please refer to the original PDF.
UGB8DT Datasheet
