UGB8DT
Key Features
- Glass passivated chip junction
- Ultrafast recovery time
- Low switching losses, high efficiency
- High forward surge capability
- Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package)
- Solder dip 260 °C, 40 s (for TO-220AC and ITO-220AC package)
- Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC
