THJP0805 chip equivalent, thermal jumper surface-mount chip.
* Electrically isolated thermal conductor
* High thermal conductivity AlN substrate (170 W/mK)
* Electrically isolated terminations (> 999 MΩ)
Available Av.
Custom sizes available.
CONSTRUCTION
Solder coating
Nickel termination
Aluminum nitride substrate
FEATURES
* E.
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Related datasheet
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