SMBJ30 Overview
SMBJ5.0 thru SMBJ188CA Vishay General Semiconductor Surface Mount TRANSZORB® Transient Voltage Suppressors DO-214AA (SMB J-Bend) PRIMARY CHARACTERISTICS VWM PPPM IFSM (uni-directional only) TJ max. 5.0 V to 188 V 600 W 100 A 150 °C DEVICES FOR BI-DIRECTION APPLICATIONS For bi-directional devices use C or CA suffix (e.g. apply in both directions.
SMBJ30 Key Features
- Low profile package
- Ideal for automated placement
- Glass passivated chip junction
- Available in uni-directional and bi-directional
- 600 W peak pulse power capability with a
- Excellent clamping capability
- Very fast response time
- Low incremental surge resistance
- Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
- Solder dip 260 °C, 40 s
