* TrenchFET® Gen IV power MOSFET
* 100 % Rg and UIS tested
* Thermally enhanced PowerPAK ChipFET package -Compact footprint area - less than 6.09 mm2 -Thin 0..

* DC/DC converters
* Motor drive control
* Synchronous rectification G
* Battery management
* L.

Si544

SI5440DC

SI5441BDC

SI5441DC

Si5442DU

SI5443DC

SI5445BDC

SI5445DC

SI5447DC

SI5449DC

Si540

SI5401DC

SI5402BDC

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