* Advanced process technology
* Surface-mount (IRFZ44S, SiHFZ44S)
* Low-profile through-hole (IRFZ44L, SiHFZ44L)
* 175 °C operating temperature Availa.

 The D2PAK is a surface-mount power package capable of accommodating die sizes up to HEX-4. It provides the highest pow.

Third generation power MOSFETs from Vishay utilize advanced processing techniques to achieve extermely low on resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that power MOSFETs are well k.

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