* Advanced process technology
* Surface mount
* Low-profile through-hole (IRFZ34L, SiHFZ34L)
* 175 °C operating temperature Available
* Fast swit.

 The D2PAK is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest pow.

Third generation power MOSFETs from Vishay utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that Power MOSFETs are well k.

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