* Halogen-free According to IEC 61249-2-21 Definition
* Advanced Process Technology
* Surface Mount (IRF9Z24S, SiHF9Z24S)
* Low-Profile Through-Hole (IRF9.

The D2PAK is a surface mount power package capable of accommodating die size up to HEX-4. It provides the highest power.

Third generation Power MOSFETs from Vishay utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that Power MOSFETs are well k.

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