* Halogen-free According to IEC 61249-2-21 Definition
* Advanced Process Technology
* Surface Mount (IRF9Z14S, SiHF9Z14S)
* Low-Profile Through-Hole (IRF9.

The D2PAK is a surface mount power package capable of accommodating die size up to HEX-4. It provides the highest power.

Third generation Power MOSFETs from Vishay utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that Power MOSFETs are well k.

IRF9Z14

IRF9Z14S

IRF9Z10

IRF9Z20

IRF9Z22

IRF9Z24

IRF9Z24L

IRF9Z24N

IRF9Z24NL

IRF9Z24NLPBF

IRF9Z24NPBF

IRF9Z24NS

IRF9Z24NSPbF

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