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FES8GT - Ultrafast Plastic Rectifier

Download the FES8GT datasheet PDF. This datasheet also covers the FES8AT variant, as both devices belong to the same ultrafast plastic rectifier family and are provided as variant models within a single manufacturer datasheet.

Key Features

  • Power pack.
  • Glass passivated pellet chip junction.
  • Ultrafast recovery time.
  • Low switching losses, high efficiency.
  • Low leakage current.
  • High forward surge capability.
  • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package).
  • Solder dip 275 °C max. , 10 s per JESD 22-B106 (for TO-220AC and ITO-220AC package).
  • AEC-Q101 qualified.
  • Material categorization: for definitions of compliance.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (FES8AT-Vishay.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number FES8GT
Manufacturer Vishay
File Size 138.48 KB
Description Ultrafast Plastic Rectifier
Datasheet download datasheet FES8GT Datasheet

📁 Similar Datasheet

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FES8GT-G 8A Super Fast Glass Passivated Rectifier SENSITRON SEMICONDUCTOR
FES8AT FAST EFFICIENT PLASTIC RECTIFIER General Semiconductor

Other Datasheets by Vishay

Part Number Description
FES8AT Ultrafast Plastic Rectifier
FES8BT Ultrafast Plastic Rectifier
FES8CT Ultrafast Plastic Rectifier
FES8DT Ultrafast Plastic Rectifier
FES8FT Ultrafast Plastic Rectifier

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
www.vishay.com FES8xT, FESF8xT, FESB8xT Vishay General Semiconductor Ultrafast Plastic Rectifier TO-220AC ITO-220AC FES8xT PIN 1 PIN 2 2 1 CASE TO-263AB K FESF8xT PIN 1 PIN 2 2 1 2 1 FESB8xT PIN 1 PIN 2 K HEATSINK PRIMARY CHARACTERISTICS IF(AV) VRRM IFSM trr VF TJ max. Package 8.0 A 50 V to 600 V 125 A 35 ns, 50 ns 0.95 V, 1.30 V, 1.50 V 150 °C TO-220AC, ITO-220AC, TO-263AB Diode variations Single die FEATURES • Power pack • Glass passivated pellet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low leakage current • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 275 °C max.