FES8AT
Key Features
- Glass passivated pellet chip junction
- Ultrafast recovery time
- Low switching losses, high efficiency
- Low leakage current
- High forward surge capability
- Meets MSL level 1, per J-STD-020, LF maximum peak of
- Solder dip 275 °C max., 10 s per JESD 22-B106
- AEC-Q101 qualified
- Material categorization: for definitions of pliance
