Download the FEP30CP datasheet PDF.
This datasheet also covers the FEP30AP variant, as both devices belong to the same dual common cathode ultrafast rectifier family and are provided as variant models within a single manufacturer datasheet.
Key Features
Glass passivated chip junction.
Ultrafast recovery time.
Low switching losses, high efficiency.
Low thermal resistance.
High forward surge capability.
Solder dip 260 °C, 40 s.
Component in accordance to RoHS 2002/95/EC and
WEEE 2002/96/EC.
Full PDF Text Transcription for FEP30CP (Reference)
Note: Below is a high-fidelity text extraction (approx. 800 characters) for
FEP30CP. For precise diagrams, and layout, please refer to the original PDF.
FEP30AP thru FEP30JP Vishay General Semiconductor Dual Common Cathode Ultrafast Rectifier 3 2 1 TO-247AD (TO-3P) PIN 1 PIN 3 PIN 2 CASE PRIMARY CHARACTERISTICS IF(AV) 30 ...
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47AD (TO-3P) PIN 1 PIN 3 PIN 2 CASE PRIMARY CHARACTERISTICS IF(AV) 30 A VRRM 50 V to 600 V IFSM 300 A trr 35 ns, 50 ns VF 0.95 V, 1.3 V, 1.5 V TJ max. 150 °C FEATURES • Glass passivated chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low thermal resistance • High forward surge capability • Solder dip 260 °C, 40 s • Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC TYPICAL APPLICATIONS For use in high frequency rectifier of switching mode power supplies, inverters, freewheeling diodes, dc-to-dc converters, and other power switching application.