FEP30CP
FEATURES
- Glass passivated chip junction
- Ultrafast recovery time
- Low switching losses, high efficiency
- Low thermal resistance
- High forward surge capability
- Solder dip 260 °C, 40 s
- ponent in accordance to Ro HS 2002/95/EC and
WEEE 2002/96/EC
TYPICAL APPLICATIONS For use in high frequency rectifier of switching mode power supplies, inverters, freewheeling diodes, dc-to-dc converters, and other power switching application.
MECHANICAL DATA Case: TO-247AD (TO-3P) Epoxy meets UL 94 V-0 flammability rating Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD22-B102 E3 suffix for consumer grade, meets JESD 201 class 1A whisker test Polarity: As marked Mounting Torque: 10 in-lbs maximum
MAXIMUM RATINGS (TA = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
FEP 30AP
FEP 30BP
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current at TC = 100 °C
Peak forward surge current 8.3 ms single half...
