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FEP16JT - Dual Common Cathode Ultrafast Plastic Rectifier

Download the FEP16JT datasheet PDF. This datasheet also covers the FEP16AT variant, as both devices belong to the same dual common cathode ultrafast plastic rectifier family and are provided as variant models within a single manufacturer datasheet.

Key Features

  • Power pack.
  • Glass passivated pellet chip junction.
  • Ultrafast recovery time.
  • Low switching losses, high efficiency.
  • High forward surge capability.
  • AEC-Q101 qualified.
  • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package).
  • Solder dip 275 °C max. 10 s, per JESD 22-B106 (for TO-220AB and ITO-220AB package).
  • Material categorization: for definitions of compliance please see www. vishay. com/doc.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (FEP16AT-Vishay.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number FEP16JT
Manufacturer Vishay
File Size 147.84 KB
Description Dual Common Cathode Ultrafast Plastic Rectifier
Datasheet download datasheet FEP16JT Datasheet

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
www.vishay.com FEP16xT, FEPF16xT, FEPB16xT Vishay General Semiconductor Dual Common Cathode Ultrafast Plastic Rectifier TO-220AB ITO-220AB FEP16xT PIN 1 PIN 3 3 2 1 PIN 2 CASE TO-263AB K FEPF16xT PIN 1 PIN 3 123 PIN 2 2 1 FEPB16xT PIN 1 K PIN 2 HEATSINK PRIMARY CHARACTERISTICS IF(AV) VRRM IFSM trr VF TJ max. Package 2 x 8.0 A 50 V to 600 V 200 A, 125 A 35 ns, 50 ns 0.95 V, 1.30 V, 1.50 V 150 °C TO-220AB, ITO-220AB, TO-263AB Diode variations Common cathode FEATURES • Power pack • Glass passivated pellet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • High forward surge capability • AEC-Q101 qualified • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 275 °C max.