CS1G Overview
150 °C Package DO-214AC (SMA) Diode variations Single die.
CS1G Key Features
- Low profile package
- Ideal for automated placement
- Glass passivated pellet chip junction
- Low forward voltage drop
- Low leakage current
- High forward surge capability
- Meets MSL level 1, per J-STD-020, LF maximum peak
- Material categorization: for definitions of pliance
