BYVF32-200 Overview
Package 0.85 V 150 °C TO-220AB, ITO-220AB, D2PAK (TO-263AB) Circuit configuration mon cathode.
BYVF32-200 Key Features
- Power pack
- Glass passivated pellet chip junction
- Ultrafast recovery time
- Low switching losses, high efficiency
- Low forward voltage drop
- High forward surge capability
- Meets MSL level 1, per J-STD-020, LF maximum peak
- Solder dip 275 °C max. 10 s, per JESD 22-B106
- AEC-Q101 qualified,