Download the BYVF32-100 datasheet PDF.
This datasheet also covers the BYV32-50 variant, as both devices belong to the same dual common-cathode ultrafast rectifier family and are provided as variant models within a single manufacturer datasheet.
Features
- Power pack.
- Glass passivated pellet chip junction.
- Ultrafast recovery time.
- Low switching losses, high efficiency.
- Low forward voltage drop.
- High forward surge capability.
- Meets MSL level 1, per J-STD-020, LF maximum peak
of 245 °C (for TO-263AB package).
- Solder dip 275 °C max. 10 s, per JESD 22-B106
(for TO-220AB and ITO-220AB package).
- AEC-Q101 qualified,
(for ITO-220AB and TO-263AB package).
BYVF32-100 Datasheet
