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Data Sheet
SMBB1550-1100
1550nm High Power TOP LED
Outline and Internal Circuit
(Unit : mm)
Features
• Chip Material : InGaAsP • Chip Dimension : 1000um * 1000um • Number of Chips : 1pce • Peak Wavelength : 1550nm typ. • Lead Frame Die : Silver Plated on Copper • Package Resin : PA9T • Lens : Silicone Resin
Application
Absolute Maximum Ratings (Tc=25°C)
Item
Symbol
Ratings
Power Dissipation
PD 1000
Forward Current
IF 700
Pulse Forward Current
IFP 2000
Reverse Voltage
VR 3
Thermal Resistance
Rthja
10
Junction Temperature
Tj 120
Operating Temperature
Topr
-40 ~ +100
Storage Temperature
Tstg -40 ~ +100
Soldering Temperature
TSOL
250
‡Pulse Forward Current condition : Duty 1% and Pulse Width=10us.
SMBB1550-1100 Datasheet
