MMBD6050WS Datasheet | UPM

Features - Very fast reverse recovery ( trr < 2.0 ns typical ) - Low capacitance ( < 2.5p F @ 0V ) - Surface mount package ideally suited for automatic insertion. - Pb free product are available : 99% Sn above can meet Ro HS environment substance directive request Mechanical Data Case: SOD-323 plastic Terminals : Solderable per MIL-STD-750,Method 2026 Approx weight : 0.008 gram Marking : T2 Absolute Ratings PARAMETER Maximum Reverse Voltage Peak Reverse Voltage Continuous Forward Current Non-repetitive Peak Forward Surge Current at t=1.0 ms SYMB OL VR VRRM IF IFSM VALUE 80 80 0.2 2.0 UNITS V V A A Thermal Characteristics PARAMETER Power Dissipation (1) Thermal Resistance, Junction to Ambient (1) Junction Temperature Storage Temperature SYMB OL PTOT RQJA TSTG VALUE 200 625 -55 to 150 -55 to 150 UNITS m W OC/W OC OC Electrical Characteristics ( TJ =25°C, unless otherwise noted) PARAMETER Reverse Breakdown Voltage SYMBOL TEST CONDITIONS VBR IR=100m A MIN. 80 TYP. - MAX. - UNITS V Reverse Current Forward Voltage Total Capacitance Reverse Recovery Time (Figure 1) NOTES: 1.FR-5 Board=1.0 x 0.75 x 0.062 in. IR VR=50V IF=1m A IF=100m A CT VR=0V, f =1MHz trr IF=IR=10m A, RL=100 W - 0.55 0.85 - - - 100 n A 0.7...