* Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA. Mechanical Data Case: Molded .

GMZ5.1

GMZ5.6

GMZ51

GMZ10

GMZ11

GMZ12

GMZ13

GMZ15

GMZ16

GMZ18

GMZ2.0

GMZ2.2

GMZ2.4

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