* Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA. Mechanical Data Case: Molded .

GMZ4.3

GMZ4.7

GMZ47

GMZ10

GMZ11

GMZ12

GMZ13

GMZ15

GMZ16

GMZ18

GMZ2.0

GMZ2.2

GMZ2.4

Since 2006. D4U Semicon.   |   Contact Us   |   Privacy Policy   |   Purchase of parts