* Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA. Mechanical Data Case: Molded .

GMZ3.0

GMZ3.3

GMZ3.6

GMZ3.9

GMZ30

GMZ33

GMZ39

GMZ10

GMZ11

GMZ12

GMZ13

GMZ15

GMZ16

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