* Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA. Mechanical Data Case: Molded .

GMZ2.2

GMZ2.4

GMZ2.7

GMZ20

GMZ22

GMZ24

GMZ27

GMZ10

GMZ11

GMZ12

GMZ13

GMZ15

GMZ16

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