GMZ11
Key Features
- * Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes MICRO-MELF .049(1.25) .047(1.2)DIA
- Mechanical Data Case: Molded Glass MICRO-MEIF Terminals: Solderable per MIL-STD-202E, Method 208 Polarity: See Diagram Below Approx
