BZX55-C5V1 Datasheet | UPM

Features - Planar Die construction - 500m W Power Dissipation - Ideally Suited for Automated Assembly Processes - Both normal and Pb free product are available : Normal : 80~95% Sn, 5~20% Pb Pb free: 98.5% Sn above DO-35 .020(0.52)TYP. 1.02(26.0)MIN. Mechanical Data Case: Molded glass DO-35 Terminals: Solderable per MIL-STD-202, Method 208 Polarity: See Diagram Below Approx. Weight: 0.13 grams Mounting Position: Any Ordering information: Suffix : " -35" to order DO-35 Package Packing information B - 2K per Bulk box T/R - 10K per 13" plastic Reel T/B - 5K per horiz. tape & Ammo box 1.02(26.0)MIN. .153(3.9)MAX. .079(2.0)MAX. Dimensions in millimeters Maximum Ratings and Electrical Characteristics (TJ =25°C, unless otherwise noted) arameter Power Dissipation at Tamb = 25 OC Symbo PTOT Junction Temperature Storage Temperature Range Valid provided that leads at a distance of 8mm from case are kept at ambient temperature. alue 00 175 -65 to +175 arameter Thermal Resistance Junction to Ambient Air ymbo Rth A in -- Forward Voltage at IF = 100m A VF -- Valid provided that leads at a distance of 10 mm from case are kept at ambient temperature. Typ --- Max. 0.3 Unit m OC OC Units K/m W Http://.upm..tw E -mail:upm.tw@msa.hinet.net...