BZX55-C2V7
Overview
- Planar Die construction * 500mW Power Dissipation * Ideally Suited for Automated Assembly Processes * Both normal and Pb free product are available : Normal : 80~95% Sn, 5~20% Pb Pb free: 98.5% Sn above DO-35 .020(0.52)TYP.
- 02(26.0)MIN. Mechanical Data Case: Molded glass DO-35 Terminals: Solderable per MIL-STD-202, Method 208 Polarity: See Diagram Below Approx. Weight: 0.13 grams Mounting Position: Any Ordering information: Suffix : " -35" to order DO-35 Package Packing information B - 2K per Bulk box
