* For surface mounted applications in order to optimize board space. * Low profile package * Built-in strain relief * Glass passivated junction * Low inductance * Plastic.

in order to optimize board space. * Low profile package * Built-in strain relief * Glass passivated junction * Low induc.

1.5SMCJ200

1.5SMCJ200C

1.5SMCJ200CA

1.5SMCJ20

1.5SMCJ20A

1.5SMCJ20C

1.5SMCJ20CA

1.5SMCJ210

1.5SMCJ210A

1.5SMCJ210C

1.5SMCJ210CA

1.5SMCJ22

1.5SMCJ220

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