* For surface mounted applications in order to optimize board space. * Low profile package * Built-in strain relief * Glass passivated junction * Low inductance * Plastic.

in order to optimize board space. * Low profile package * Built-in strain relief * Glass passivated junction * Low induc.

1.5SMCJ180

1.5SMCJ180C

1.5SMCJ180CA

1.5SMCJ18

1.5SMCJ18A

1.5SMCJ18C

1.5SMCJ18CA

1.5SMCJ10

1.5SMCJ100

1.5SMCJ100A

1.5SMCJ100C

1.5SMCJ100CA

1.5SMCJ10A

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