UT12005
Key Features
- 1. Meets IEEE 802.3 and ANSI X.3.263 standards including 350uH OCL with 8mA bias
- Designed for reflow soldering at temperature 230±5 o C
- pact footprint for use in the most space restrictive applications
- Turns Ratio tolerance: ±5%
- Turns Ratio tolerance:±3%, Pin(1-3):(16-14), Pin(6-8):(11-9)
- Cw/w: 35pF max. Pri. to Sec. 1MHz, 1Vrms
- to . Mode Rejection: -40dB typ. @ 0.10--100MHz
- Crosstalk: -40dB min. @ 0.10--100MHz
- HI-POT: 1500Vrms/2sec. Leakage Current 0.5mA Max./input to output Dimensions & Schematic: NOTE
- Packaging information-tape and reel according to item no. “SO16A” of data sheet 01-00
